Integrated circuit package system with redistribution layer and method for manufacturing thereof

ABSTRACT

A method for manufacturing an integrated circuit package system includes: providing a base device; attaching a base interconnect to the base device; applying an encapsulant over the base device and the base interconnect; and forming a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This is a continuation of co-pending U.S. patent application Ser. No.12/207,459 filed Sep. 9, 2008.

TECHNICAL FIELD

The present invention relates generally to integrated circuit packagesystems and more particularly to a system for integrated circuit packagewith redistribution layer.

BACKGROUND ART

Virtually all aspects of modern life have been touched by integratedcircuit semiconductor devices. From portable personal devices toindustrial equipment, electronic devices improve processes and machinesthat we often take for granted.

The sometimes behind the scenes market for electronic devicesincreasingly demands more functions with faster response in reduceddimensions and at lower prices. These high performance devices oftendemand all of lighter, faster, smaller, multi-functional, highlyreliable, and lower cost.

In efforts to meet such requirements, improvements have been attemptedin many aspects of electronic product development such as producingsmaller and less expensive semiconductor chips. Unfortunately, thisdevelopment is still not enough to satisfy the demands.

A commonly used integrated circuit or semiconductor device methodologyfor packaging uses a substrate for the semiconductor chips. Thesubstrate or “board” provides a connection pattern of input and outputelements such as contacts, leads, or other electrodes. Typically, thechip is positioned on the substrate having an input/output electrodesurface that is connected to an “active” surface of the chip.

In order to provide desired connection patterns, a substrate typicallyincludes planar dielectrics, electrical contacts on the die-facing sideof the substrate, conductive traces that extend laterally along theplanar dielectrics, and contact pads, or “terminals,” that are exposedat an opposite surface of the substrate. A substrate may also includeconductive vias extending through a portion of the substrate thicknessfor interconnectivity.

Numerous technologies have been developed to meet these requirements.Some research and development focused on new package technologies whileothers focused on improving existing and mature package technologies.Research and development in package technologies may include a seeminglyendless number of different approaches.

One proven way to reduce cost is to use package technologies withexisting manufacturing methods and equipments. Paradoxically, the reuseof existing manufacturing processes does not typically result in thereduction of package size. Existing packaging technologies struggle tocost effectively meet demands of today's integrated circuit packages.

Of course, the requirement of additional material including thesubstrate undesirably increases the thickness and cost of fabricatingthe package. Moreover, the use of an additional substrate material mayundesirably increase the manufacturing cycle time, which can alsoincrease cost.

Despite the advantages of recent developments in semiconductorfabrication and packaging techniques, there is a continuing need forimproving electronic device size, performance, reliability, andmanufacturing.

Thus, a need still remains for an integrated circuit package system withimproved manufacturing processes and materials.

In view of the ever-increasing commercial competitive pressures, alongwith growing consumer expectations and the diminishing opportunities formeaningful product differentiation in the marketplace, it is criticalthat answers be found for these problems.

Additionally, the need to save costs, improve efficiencies andperformance, and meet competitive pressures, adds an even greaterurgency to the critical necessity for finding answers to these problems.

Solutions to these problems have been long sought but prior developmentshave not taught or suggested any solutions and, thus, solutions to theseproblems have long eluded those skilled in the art.

DISCLOSURE OF THE INVENTION

The present invention provides a method for manufacturing an integratedcircuit package system including: providing a base device; attaching abase interconnect to the base device; applying an encapsulant over thebase device and the base interconnect; and forming a re-routing filmover the encapsulant, the base device, and the base interconnect forconnectivity without a substrate.

The present invention provides an integrated circuit package systemincluding: a base device; a base interconnect connected to the basedevice; an encapsulant over the base device and the base interconnect;and a re-routing film over the encapsulant, the base device, and thebase interconnect for connectivity without a substrate.

Certain embodiments of the invention have other aspects in addition toor in place of those mentioned above. The aspects will become apparentto those skilled in the art from a reading of the following detaileddescription when taken with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of an integrated circuit package systemtaken along line 1-1 of FIG. 3 in a first embodiment of the presentinvention;

FIG. 2 is a detailed view of a portion of the structure of FIG. 1;

FIG. 3 is a bottom plan view of the integrated circuit package system;

FIG. 4 is a cross-section view of the integrated circuit package systemin a device attaching phase;

FIG. 5 is the structure of FIG. 4 in another device attaching phase;

FIG. 6 is the structure of FIG. 5 in an encapsulation phase;

FIG. 7 is the structure of FIG. 6 in another carrier phase;

FIG. 8 is the structure of FIG. 7 in a routing phase;

FIG. 9 is a cross-sectional view of an integrated circuit package systemtaken along line 9-9 of FIG. 11 in a second embodiment of the presentinvention;

FIG. 10 is a detailed view of a portion of the structure of FIG. 9;

FIG. 11 is a bottom plan view of the integrated circuit package system;

FIG. 12 is a cross-section view of the integrated circuit package systemin a device attaching phase;

FIG. 13 is the structure of FIG. 12 in another device attaching phase;

FIG. 14 is the structure of FIG. 13 in an encapsulation phase;

FIG. 15 is the structure of FIG. 14 in another carrier phase;

FIG. 16 is the structure of FIG. 15 in a routing phase;

FIG. 17 is a cross-sectional view of an integrated circuit packagesystem in a third embodiment of the present invention;

FIG. 18 is a cross-sectional view of an integrated circuit packagesystem taken along line 18-18 of FIG. 20 in a fourth embodiment of thepresent invention;

FIG. 19 is a detailed view of a portion of the structure of FIG. 18;

FIG. 20 is a bottom plan view of the integrated circuit package system;and

FIG. 21 is a flow chart of an integrated circuit package system formanufacturing the integrated circuit package system in an embodiment ofthe present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

The following embodiments are described in sufficient detail to enablethose skilled in the art to make and use the invention. It is to beunderstood that other embodiments would be evident based on the presentdisclosure, and that system, process, or mechanical changes may be madewithout departing from the scope of the present invention.

In the following description, numerous specific details are given toprovide a thorough understanding of the invention. However, it will beapparent that the invention may be practiced without these specificdetails. In order to avoid obscuring the present invention, somewell-known circuits, system configurations, and process steps are notdisclosed in detail. Likewise, the drawings showing embodiments of thesystem are semi-diagrammatic and not to scale and, particularly, some ofthe dimensions are for the clarity of presentation and are shown greatlyexaggerated in the drawing FIGS.

Where multiple embodiments are disclosed and described, having somefeatures in common, for clarity and ease of illustration, description,and comprehension thereof, similar and like features one to another willordinarily be described with like reference numerals. The embodimentsmay be numbered first embodiment, second embodiment, etc. as a matter ofdescriptive convenience and are not intended to have any othersignificance or provide limitations for the present invention.

For expository purposes, the term “horizontal” as used herein is definedas a plane parallel to the plane or surface of the invention, regardlessof its orientation. The term “vertical” refers to a directionperpendicular to the horizontal as just defined. Terms, such as “on”,“above”, “below”, “bottom”, “top”, “side” (as in “sidewall”), “upward”,“downward”, “higher”, “lower”, “upper”, “over”, and “under”, are definedwith respect to the horizontal plane.

The term “on” as used herein means and refers to direct contact amongelements. The term “processing” as used herein includes deposition ofmaterial, patterning, exposure, development, etching, cleaning, and/orremoval of the material or trimming as required in forming a describedstructure. The term “system” as used herein means and refers to themethod and to the apparatus of the present invention in accordance withthe context in which the term is used.

Referring now to FIG. 1, therein is shown a cross-sectional view of anintegrated circuit package system 100 taken along line 1-1 of FIG. 3 ina first embodiment of the present invention. The integrated circuitpackage system 100 preferably includes a redistribution network 102, abase device 104, and base interconnects 106.

The redistribution network 102 can be formed of one or more re-routingfilms 108 such as thin film conductors including integrated passivedevices (IPD), or redistribution layers (RDL). The re-routing films 108can be formed in a range of a few micrometers and provide an internalside 112 and an external side 114 of the redistribution network 102.

The base interconnects 106 such as wire bonds, planar interconnect,bumps, or any conductive material with any connection technology caninclude a base ball-end 110. The base ball-end 110 can be formed overthe internal side 112 of the redistribution network 102 electricallyconnecting one of the re-routing films 108 to a base front side 116 ofthe base device 104.

For illustrative purposes, the base ball-end 110 is shown as acompressed or coined ball although it is understood that the baseball-end 110 can be formed differently. For example, the base ball-end110 can be formed having a portion extending beyond a plane of a baseback side 118 of the base device 104.

The base back side 118 can provide an attachment surface for theredistribution network 102. The base device 104 such as an integratedcircuit die, an integrated circuit package, an internal stacking module,an interposer, or any other device can be attached over theredistribution network 102.

A stack device 120 such as an integrated circuit die, an integratedcircuit package, an internal stacking module, an interposer, or anyother device can be mounted over the base device 104. The stack device120 having stack connectors 122 can be mounted with an attach layer 124such as a silicon spacer, film, or wire in film material.

Stack interconnects 126 such as wire bonds, planar interconnect, bumps,or any conductive material with any connection technology can include astack ball-end 128. The stack ball-end 128 can be formed over theinternal side 112 of the redistribution network 102 electricallyconnecting one of the re-routing films 108 to the stack device 120.

An encapsulant 130 can cover and protect the stack interconnects 126,the stack device 120, the attach layer 124, the base interconnects 106,or the base device 104. The encapsulant 130 can optionally include anencapsulant cavity 132 such as fan-in cavity for a package on package orother component. The encapsulant cavity 132 can provide a portion of thestack device 120 including a portion of the stack connectors 122substantially exposed.

Package connectors 134 can be formed on a side opposite the base device104 over the external side 114 of the redistribution network 102. Thepackage connectors 134 can provide electrical connectivity to a nextlevel system such as another package, a printed circuit board, or anyother component.

It has been unexpectedly discovered that the present invention havingthe redistribution network 102 provides improved package thicknessresulting in a reduction of two tenths of a millimeter or more. Theredistribution network 102 can replace a substrate (not shown) having athickness of more than two tenths of a millimeter.

Referring now to FIG. 2, therein is shown a detailed view of a portionof the structure of FIG. 1. The base ball-end 110 is shown as acompressed or coined ball having a portion extending beyond a plane ofthe base back side 118 of FIG. 1.

The re-routing films 108 can include a re-routing recess 202 for theportion of the base ball-end 110 or the stack ball-end 128 extendingbeyond a plane of the base back side 118.

Referring now to FIG. 3, therein is shown a bottom plan view of theintegrated circuit package system 100. The integrated circuit packagesystem 100 preferably includes the package connectors 134, the baseball-end 110, the stack ball-end 128, the re-routing films 108, and theencapsulant 130.

The redistribution network 102 with the re-routing films 108 providesinterconnection of the base device 104 of FIG. 1, the stack device 120of FIG. 1, and a next level system without the need for a conventionalsubstrate.

Referring now to FIG. 4, therein is shown a cross-section view of theintegrated circuit package system 100 in a device attaching phase. Theintegrated circuit package system 100 preferably includes the basedevice 104 attached over a base provisional carrier 402 that can beremoved during further processing.

Optionally the base provisional carrier 402 can be attached to a wafer(not shown). The wafer can be singulated such as by wafer saw. Expansionof the base provisional carrier 402 can provide spacing between one andanother of the base device 104.

The base provisional carrier 402 includes a base support layer 404 and abase penetrable layer 406. The base interconnects 106 can be connectedto the base front side 116 of the base device 104 and the base ball-end110 can be over the base support layer 404 and embedded in the basepenetrable layer 406.

The base ball-end 110 can be formed below the base back side 118 of thebase device 104 on a side opposite the attach layer 124 applied over thebase front side 116 for attaching another device.

For illustrative purposes, two of the base device 104 are shown althoughit is understood that any number of the base device 104 may be used. Anarray of the base device 104 can be formed during processing for volumemanufacturing.

Referring now to FIG. 5, therein is shown the structure of FIG. 4 inanother device attaching phase. The integrated circuit package system100 preferably includes the stack device 120 over the attach layer 124and the base device 104.

The stack interconnects 126 can be connected to the stack device 120 andthe stack ball-end 128 can be over the base support layer 404 andembedded in the base penetrable layer 406. The stack ball-end 128 can beformed below the base back side 118 of the base device 104.

Referring now to FIG. 6, therein is shown the structure of FIG. 5 in anencapsulation phase. The integrated circuit package system 100preferably includes the encapsulant 130 over the stack interconnects126, the stack device 120, the attach layer 124, the base interconnects106, and the base device 104.

The encapsulant 130 can optionally include the encapsulant cavity 132providing a portion of the stack device 120 including a portion of thestack connectors 122 substantially exposed for a package on package orother component.

Referring now to FIG. 7, therein is shown the structure of FIG. 6 inanother carrier phase. The integrated circuit package system 100preferably includes a stack provisional carrier 702 over theencapsulation on a side opposite the base provisional carrier 402 ofFIG. 4.

The stack provisional carrier 702 such as a dummy silicon wafer, a tape,an organic carrier, a metal sheet, or other structural material canprotect and provide structural integrity to the integrated circuitpackage system 100 during manufacturing. The stack provisional carrier702 can be removed during further processing.

The base ball-end 110 and the stack ball-end 128 can be compressed orcoined to form an interconnect surface such as a pad. Optionally, aninsulating layer (not shown) can be formed over the base back side 118.

Referring now to FIG. 8, therein is shown the structure of FIG. 7 in arouting phase. The integrated circuit package system 100 preferablyincludes the redistribution network 102 formed over the base ball-end110, the stack ball-end 128, the base device 104, and the encapsulant130.

One or more of the re-routing films 108 can be formed by thin filmtechnology to form the redistribution network 102 over the base backside 118 of the base device 104. The internal side 112 of theredistribution network 102 can provide the re-routing recess 202 for thebase ball-end 110.

The package connectors 134 can be attached to the external side 114 ofthe redistribution network 102. The re-routing films 108 of the externalside 114 provide electrical connectivity to the package connectors 134and thereby electrical connectivity to a next level system such asanother package, a printed circuit board, or any other component.

Referring now to FIG. 9, therein is shown a cross-sectional view of anintegrated circuit package system 900 taken along line 9-9 of FIG. 11 ina second embodiment of the present invention. The integrated circuitpackage system 900 preferably includes a redistribution network 902, abase device 904, and base interconnects 906.

The redistribution network 902 can be formed of one or more re-routingfilms 908 such as thin film conductors including integrated passivedevices (IPD), or redistribution layers (RDL). The re-routing films 908can be formed in a range of a few micrometers and provide an internalside 912 and an external side 914 of the redistribution network 902.

The base interconnects 906 such as wire bonds, planar interconnect,bumps, or any conductive material with any connection technology caninclude a base ball-end 910. The base ball-end 910 can be formed overthe internal side 912 of the redistribution network 902 electricallyconnecting one of the re-routing films 908 to a base front side 916 ofthe base device 904.

For illustrative purposes, the base ball-end 910 is shown as acompressed or coined ball although it is understood that the baseball-end 910 can be formed differently. For example, the base ball-end910 can be formed having a side substantially planar to a base back side918 of the base device 904.

The base back side 918 can provide an attachment surface for theredistribution network 902. The base device 904 such as an integratedcircuit die, an integrated circuit package, an internal stacking module,an interposer, or any other device can be attached over theredistribution network 902.

A stack device 920 such as an integrated circuit die, an integratedcircuit package, an internal stacking module, an interposer, or anyother device can be mounted over the base device 904. The stack device920 having stack connectors 922 can be mounted with an attach layer 924such as a silicon spacer, film, or wire in film material.

Stack interconnects 926 such as wire bonds, planar interconnect, bumps,or any conductive material with any connection technology can include astack ball-end 928. The stack ball-end 928 can be formed over theinternal side 912 of the redistribution network 902 electricallyconnecting one of the re-routing films 908 to the stack device 920.

An encapsulant 930 can cover and protect the stack interconnects 926,the stack device 920, the attach layer 924, the base interconnects 906,or the base device 904. The encapsulant 930 can optionally include anencapsulant cavity 932 such as fan-in cavity for a package on package orother component. The encapsulant cavity 932 can provide a portion of thestack device 920 including a portion of the stack connectors 922substantially exposed.

Package connectors 934 can be formed on a side opposite the base device904 over the external side 914 of the redistribution network 902. Thepackage connectors 934 can provide electrical connectivity to a nextlevel system such as another package, a printed circuit board, or anyother component.

Referring now to FIG. 10, therein is shown a detailed view of a portionof the structure of FIG. 9. The base ball-end 910 is shown as acompressed or coined ball having a side substantially planar to the baseback side 918 of FIG. 9.

The re-routing films 908 can include a region for electricalconnectivity of the base ball-end 910 or the stack ball-end 928 that canbe formed substantially planar to the base back side 918.

Referring now to FIG. 11, therein is shown a bottom plan view of theintegrated circuit package system 900. The integrated circuit packagesystem 900 preferably includes the package connectors 934, the baseball-end 910, the stack ball-end 928, the re-routing films 908, and theencapsulant 930.

The redistribution network 902 with the re-routing films 908 providesinterconnection of the base device 904 of FIG. 9, the stack device 920of FIG. 9, and a next level system without the need for a conventionalsubstrate.

Referring now to FIG. 12, therein is shown a cross-section view of theintegrated circuit package system 900 in a device attaching phase. Theintegrated circuit package system 900 preferably includes the basedevice 904 attached over a base provisional carrier 1202 that can beremoved during further processing.

The base provisional carrier 1202 includes a support side 1204 and amounting side 1206. The base interconnects 906 can be connected to thebase front side 916 of the base device 904 and the base ball-end 910 canbe over the support side 1204 and embedded in the mounting side 1206.

The base ball-end 910 can be formed substantially planar to a plane ofthe base back side 918 of the base device 904 on a side opposite theattach layer 924 applied over the base front side 916 for attachinganother device.

For illustrative purposes, two of the base device 904 are shown althoughit is understood that any number of the base device 904 may be used. Anarray of the base device 904 can be formed during processing for volumemanufacturing.

Referring now to FIG. 13, therein is shown the structure of FIG. 12 inanother device attaching phase. The integrated circuit package system900 preferably includes the stack device 920 over the attach layer 924and the base device 904.

The stack interconnects 926 can be connected to the stack device 920 andthe stack ball-end 928 can be over the mounting side 1206. The stackball-end 928 can be formed substantially planar to a plane of the baseback side 918 of the base device 904.

Referring now to FIG. 14, therein is shown the structure of FIG. 13 inan encapsulation phase. The integrated circuit package system 900preferably includes the encapsulant 930 over the stack interconnects926, the stack device 920, the attach layer 924, the base interconnects906, and the base device 904.

The encapsulant 930 can optionally include the encapsulant cavity 932providing a portion of the stack device 920 including a portion of thestack connectors 922 substantially exposed for a package on package orother component.

Referring now to FIG. 15, therein is shown the structure of FIG. 14 inanother carrier phase. The integrated circuit package system 900preferably includes a stack provisional carrier 1502 over theencapsulation on a side opposite the base provisional carrier 1202 ofFIG. 12.

The stack provisional carrier 1502 such as a dummy silicon wafer, atape, an organic carrier, a metal sheet, or other structural materialcan protect and provide structural integrity to the integrated circuitpackage system 900 during manufacturing. The stack provisional carrier1502 can be removed during further processing.

The base ball-end 910 and the stack ball-end 928 can be compressed orcoined to form an interconnect surface such as a pad. Optionally, aninsulating layer (not shown) can be formed over the base back side 918.

Referring now to FIG. 16, therein is shown the structure of FIG. 15 in arouting phase. The integrated circuit package system 900 preferablyincludes the redistribution network 902 formed over the base ball-end910, the stack ball-end 928, the base device 904, and the encapsulant930.

One or more of the re-routing films 908 can be formed by thin filmtechnology to form the redistribution network 902 over the base backside 918 of the base device 904. The internal side 912 of theredistribution network 902 can provide a connection surface for the baseball-end 910.

The package connectors 934 can be attached to the external side 914 ofthe redistribution network 902. The re-routing films 908 of the externalside 914 provide electrical connectivity to the package connectors 934and thereby electrical connectivity to a next level system such asanother package, a printed circuit board, or any other component.

Referring now to FIG. 17, therein is shown a cross-sectional view of anintegrated circuit package system 1700 in a third embodiment of thepresent invention. The integrated circuit package system 1700 preferablyincludes a redistribution network 1702, a base device 1704, and baseinterconnects 1706.

The redistribution network 1702 can be formed of one or more re-routingfilms 1708 such as thin film conductors including integrated passivedevices (IPD), or redistribution layers (RDL). The re-routing films 1708can be formed in a range of a few micrometers and provide an internalside 1712 and an external side 1714 of the redistribution network 1702.

The base interconnects 1706 such as wire bonds, planar interconnect,bumps, or any conductive material with any connection technology caninclude a base ball-end 1710. The base ball-end 1710 can be formed overthe internal side 1712 of the redistribution network 1702 electricallyconnecting one of the re-routing films 1708 to components.

For illustrative purposes, the base ball-end 1710 is shown as acompressed or coined ball although it is understood that the baseball-end 1710 can be formed differently. For example, the base ball-end1710 can be formed having a portion extending beyond a plane of a baseback side 1718 of the base device 1704.

The base back side 1718 can provide an attachment surface for theredistribution network 1702. The base device 1704 such as athrough-silicon-via die or any other device can be attached over theredistribution network 1702.

A base stack device 1720 such as a through-silicon-via die can beattached over the base device 1704. The base stack device 1720 can beelectrically connected with a through-silicon-via connector 1722. Thethrough-silicon-via connector 1722 can be formed through the base device1704.

The redistribution network 1702 can provide improved package thicknessresulting in a reduction of two tenths of a millimeter or more. Theredistribution network 1702 can replace a substrate (not shown) having athickness of more than two tenths of a millimeter and providing spacingfor two or more through-silicon-via devices such as the base device 1704and the base stack device 1720.

A stack device 1724 such as an integrated circuit die, an integratedcircuit package, an internal stacking module, an interposer, or anyother device can be mounted over the base device 1704. The stack device1724 having stack connectors 1726 can be mounted with an attach layer1728 such as a wire in film material. The base interconnects 1706 can beformed partially within the attach layer 1728.

Stack interconnects 1730 such as wire bonds, planar interconnect, bumps,or any conductive material with any connection technology can include astack ball-end 1732. The stack ball-end 1732 can be formed over theinternal side 1712 of the redistribution network 1702 electricallyconnecting one of the re-routing films 1708 to the stack device 1724.

An encapsulant 1734 can cover and protect the stack interconnects 1730,the stack device 1724, the attach layer 1728, the base interconnects1706, or the base device 1704. The encapsulant 1734 can optionallyinclude an encapsulant cavity 1736 such as fan-in cavity for a packageon package or other component. The encapsulant cavity 1736 can provide aportion of the stack device 1724 including a portion of the stackconnectors 1726 substantially exposed.

Package connectors 1738 can be formed on a side opposite the base device1704 over the external side 1714 of the redistribution network 1702. Thepackage connectors 1738 can provide electrical connectivity to a nextlevel system such as another package, a printed circuit board, or anyother component.

Referring now to FIG. 18, therein is shown a cross-sectional view of anintegrated circuit package system 1800 taken along line 18-18 of FIG. 20in a fourth embodiment of the present invention. The integrated circuitpackage system 1800 preferably includes a redistribution network 1802, abase device 1804, and base interconnects 1806.

The redistribution network 1802 can be formed of one or more re-routingfilms 1808 such as thin film conductors including integrated passivedevices (IPD), or redistribution layers (RDL). The re-routing films 1808can be formed in a range of a few micrometers and provide an internalside 1812 and an external side 1814 of the redistribution network 1802.

The base interconnects 1806 such as wire bonds, planar interconnect,bumps, or any conductive material with any connection technology caninclude a base ball-end 1810. The base ball-end 1810 can be formed overthe internal side 1812 of the redistribution network 1802 electricallyconnecting one of the re-routing films 1808 to a base front side 1816 ofthe base device 1804.

For illustrative purposes, the base ball-end 1810 is shown as acompressed or coined ball although it is understood that the baseball-end 1810 can be formed differently. For example, the base ball-end1810 can be formed having a portion extending beyond a plane of a baseback side 1818 of the base device 1804.

The base back side 1818 can provide an attachment surface for theredistribution network 1802. The base device 1804 such as a pre-testedintegrated circuit die, integrated circuit package, internal stackingmodule, interposer, or component can be attached over the redistributionnetwork 1802.

A stack device 1820 such as a pre-tested integrated circuit die,integrated circuit package, internal stacking module, interposer, orcomponent can be mounted over the base device 1804. The stack device1820 having stack connectors 1822 can be mounted with an attach layer1824 such as a silicon spacer, film, or wire in film material.

Stack interconnects 1826 such as wire bonds, planar interconnect, bumps,or any conductive material with any connection technology can include astack ball-end 1828. The stack ball-end 1828 can be formed over theinternal side 1812 of the redistribution network 1802 electricallyconnecting one of the re-routing films 1808 to the stack device 1820.

An encapsulant 1830 can cover and protect the stack interconnects 1826,the stack device 1820, the attach layer 1824, the base interconnects1806, or the base device 1804. The encapsulant 1830 can.

Package connectors 1834 can be formed on a side opposite the base device1804 over the external side 1814 of the redistribution network 1802. Thepackage connectors 1834 can provide electrical connectivity to a nextlevel system such as another package, a printed circuit board, or anyother component.

Referring now to FIG. 19, therein is shown a detailed view of a portionof the structure of FIG. 18. The base ball-end 1810 is shown as acompressed or coined ball having a portion extending beyond a plane ofthe base back side 1818 of FIG. 18.

The re-routing films 1808 can include a re-routing recess 1902 for theportion of the base ball-end 1810 or the stack ball-end 1828 extendingbeyond a plane of the base back side 1818.

Referring now to FIG. 20, therein is shown a bottom plan view of theintegrated circuit package system 1800. The integrated circuit packagesystem 1800 preferably includes the package connectors 1834, the baseball-end 1810, the stack ball-end 1828, the re-routing films 1808, andthe encapsulant 1830.

The redistribution network 1802 with the re-routing films 1808 providesinterconnection of the base device 1804 of FIG. 18, the stack device1820 of FIG. 18, and a next level system without the need for aconventional substrate.

Referring now to FIG. 21, therein is shown a flow chart of an integratedcircuit package system 2100 for manufacturing the integrated circuitpackage system 100 in an embodiment of the present invention. The system2100 includes providing a base device in a block 2102; attaching a baseinterconnect to the base device in a block 2104; applying an encapsulantover the base device and the base interconnect in a block 2106; andforming a re-routing film over the encapsulant, the base device, and thebase interconnect for connectivity without a substrate in a block 2108.

In greater detail, a system to provide the method and apparatus of theintegrated circuit package system 100, in an embodiment of the presentinvention, is performed as follows:

1. Providing a base device having a base front side and a base backside.

2. Attaching a base interconnect to the base front side and having abase ball-end near the base back side.

3. Applying an encapsulant over the base device and the baseinterconnect with the base back side and the base ball-end substantiallyexposed.

4. Forming a re-routing film over the encapsulant, the base device, andthe base interconnect for connectivity without a substrate.

5. Attaching a package connector over a side of the re-routing filmopposite the base device.

Thus, it has been discovered that the integrated circuit package systemmethod and apparatus of the present invention furnish important andheretofore unknown and unavailable solutions, capabilities, andfunctional aspects.

The resulting processes and configurations are straightforward,cost-effective, uncomplicated, highly versatile, accurate, sensitive,and effective, and can be implemented by adapting known components forready, efficient, and economical manufacturing, application, andutilization.

While the invention has been described in conjunction with a specificbest mode, it is to be understood that many alternatives, modifications,and variations will be apparent to those skilled in the art in light ofthe aforegoing description.

Accordingly, it is intended to embrace all such alternatives,modifications, and variations, which fall within the scope of theincluded claims. All matters hithertofore set forth herein or shown inthe accompanying drawings are to be interpreted in an illustrative andnon-limiting sense.

1. A method for manufacturing an integrated circuit package systemcomprising: providing a base device; attaching a base interconnect tothe base device; applying an encapsulant over the base device and thebase interconnect; and forming a re-routing film over the encapsulant,the base device, and the base interconnect for connectivity without asubstrate.
 2. The method as claimed in claim 1 wherein attaching thebase interconnect includes forming a base ball-end substantiallycoplanar to a plane of a base back side of the base device.
 3. Themethod as claimed in claim 1 wherein attaching the base device includesattaching more than one of a through-silicon-via device.
 4. The methodas claimed in claim 1 further comprising attaching a stack device overthe base device.
 5. A method for manufacturing an integrated circuitpackage system comprising: providing a base device having a base frontside and a base back side; attaching a base interconnect to the basefront side and having a base ball-end near the base back side; applyingan encapsulant over the base device and the base interconnect with thebase back side and the base ball-end substantially exposed; forming are-routing film over the encapsulant, the base device, and the baseinterconnect for connectivity without a substrate; and attaching apackage connector over a side of the re-routing film opposite the basedevice.
 6. The method as claimed in claim 5 wherein applying theencapsulant includes forming an encapsulant cavity on a side oppositethe re-routing film.
 7. The method as claimed in claim 5 furthercomprising applying a wire-in-film material over the base device.
 8. Themethod as claimed in claim 5 further comprising attaching a stack deviceover the base device wherein a stack connector of the stack device is ona side opposite the base device.
 9. The method as claimed in claim 5further comprising attaching a stack device over the base device whereinthe stack device is an integrated circuit package.
 10. An integratedcircuit package system comprising: a base device; a base interconnectconnected to the base device; an encapsulant over the base device andthe base interconnect; and a re-routing film over the encapsulant, thebase device, and the base interconnect for connectivity without asubstrate.
 11. The system as claimed in claim 10 wherein the baseinterconnect includes a base ball-end substantially coplanar to a planeof a base back side of the base device.
 12. The system as claimed inclaim 10 wherein the base device includes more than one of athrough-silicon-via device.
 13. The system as claimed in claim 10further comprising a stack device over the base device.
 14. The systemas claimed in claim 10 further comprising: the base device has a basefront side and a base back side; the base interconnect is attached tothe base front side and having a base ball-end near the base back side;the encapsulant is over the base device and the base interconnect withthe base back side and the base ball-end substantially exposed; there-routing film is over the encapsulant, the base back side, and thebase ball-end for connectivity without a substrate; and a packageconnector is over a side of the re-routing film opposite the basedevice.
 15. The system as claimed in claim 14 wherein the encapsulantincludes an encapsulant cavity on a side opposite the re-routing film.16. The system as claimed in claim 14 further comprising a wire-in-filmmaterial over the base device.
 17. The system as claimed in claim 14further comprising a stack device over the base device wherein a stackconnector of the stack device is on a side opposite the base device. 18.The system as claimed in claim 14 further comprising a stack device overthe base device wherein the stack device is an integrated circuitpackage.